Alphatechsys Automation, now part of the Basler group, will be participating in Automation Expo South 2026, this March.
At our booth, you will see: · Complete computer vision product portfolio from Basler · Applications for factory automation, electronics, automotive, Semiconductor, and more Whether you’re building new machines, upgrading existing systems, or exploring camera-based inspections- we have something powerful to show you. Our experts will be available for technical discussions and product demonstrations to […]
Hybrid Bonding: The New Precision Bottleneck in Advanced Packaging
Hybrid bonding has evolved from an advanced packaging option into a strategic enabler for next-generation semiconductors. As transistor scaling slows, performance gains now rely on ultra-dense 3D integration. By combining dielectric bonding with direct copper-to-copper interconnects, hybrid bonding eliminates solder bumps, supports sub-10 µm pitches, and delivers higher bandwidth, lower power, and compact designs essential for AI and HBM architectures.
AI-supported picking of consumer goods packaging
The use of 3D image processing and our ItemPickAI software increases efficiency and precision in warehouse logistics. The software supports the picking process: the AI recognizes consumer goods (e.g. food, drugstore, and electronic items) in densely packed containers and provides precise gripping points for the robot. Benefits: lower error rates and faster order processing.